Cantara/.claude/skills/manufacturers/winbond
.claude/skills/manufacturers/winbond/SKILL.md
# Winbond Manufacturer Handler Skill ## Overview WinbondHandler manages Winbond memory components including SPI Flash, NOR Flash, and EEPROM. ## Supported Component Types - MEMORY - MEMORY_FLASH_WINBOND - MEMORY_EEPROM_WINBOND - MEMORY_FLASH - MEMORY_EEPROM ## MPN Patterns ### SPI/QSPI Flash (W25 Series) | Prefix | Description | |--------|-------------| | W25Qxx | Standard SPI/QSPI Flash | | W25Nxx | SPI NAND Flash | | W25Xxx | Legacy SPI Flash | ### NOR Flash (W29 Series) | Prefix | Descri
$ install --global
skillsauthnpx skillsauth add Cantara/lib-electronic-components .claude/skills/manufacturers/winbondInstall this skill globally with one command. Works with Claude Code, Cursor, and Windsurf.
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Last scanned: Apr 24, 2026, 8:56 PM1.9s1 file scanned
SKILL.md
Winbond Manufacturer Handler Skill
Overview
WinbondHandler manages Winbond memory components including SPI Flash, NOR Flash, and EEPROM.
Supported Component Types
- MEMORY
- MEMORY_FLASH_WINBOND
- MEMORY_EEPROM_WINBOND
- MEMORY_FLASH
- MEMORY_EEPROM
MPN Patterns
SPI/QSPI Flash (W25 Series)
| Prefix | Description | |--------|-------------| | W25Qxx | Standard SPI/QSPI Flash | | W25Nxx | SPI NAND Flash | | W25Xxx | Legacy SPI Flash |
NOR Flash (W29 Series)
| Prefix | Description | |--------|-------------| | W29Cxx | Parallel NOR Flash | | W29Nxx | NOR Flash variant | | W29Exx | NOR Flash variant |
EEPROM (W24 Series)
| Prefix | Description | |--------|-------------| | W24xxx | Serial EEPROM |
Package Codes
| Suffix | Package | |--------|---------| | S, SS | SOIC | | F | QFN | | W | WSON | | U | USON |
Series Extraction
Returns base series including density code (e.g., "W25Q32JV" returns "W25Q32JV").
Package Code Extraction
Extracts suffix letters and maps to package type.
Custom matches() Implementation
Handler overrides matches() for direct pattern matching:
- W25[QNX][0-9]+ for SPI/QSPI Flash
- W29[CNE][0-9]+ for NOR Flash
- W24\d+ for EEPROM
Replacement Logic
- Same series with different package or variant are compatible
- Must have same density
Test Patterns
When testing WinbondHandler:
- Use documentation tests for
matches()behavior - Use assertions for
extractPackageCode(),extractSeries(), null handling - Instantiate directly:
new WinbondHandler()
Known Handler Issues
All issues fixed in PR #88
Common Part Numbers
| Part Number | Description | |-------------|-------------| | W25Q128JVSIQ | 128Mbit QSPI Flash, SOIC-8 | | W25Q32JVSSIQ | 32Mbit QSPI Flash, SOIC-8 | | W25Q64FVFIG | 64Mbit QSPI Flash, QFN | | W25N01GVZEIG | 1Gbit SPI NAND Flash |
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